A silicon boule has been processed through grinding to provide a cylinder whose diameter = 285 mm and whose length = 900 mm. Next, it will be sliced into wafers 0.7 mm thick using a cut-off saw with a kerf = 0.5 mm. The wafers thus produced will be used to fabricate as many IC chips as possible for the personal computer market. Each IC has a market value to the company of $98. Each chip is square with 15 mm on a side. The processable area of each wafer is defined by a diameter = 270 mm. Estimate the value of all of the IC chips that could be produced, assuming an overall yield of 80% good product.