A SI wafer will tend to cleave (break apart) along {111} planes if sufficient stress isapplied to the surface of the wafer. If the top surface of the wafer is a (100) plane aspictured in Fig. P1.9:
(a) What are the possible angles between the normal to the top surface and thecleavage planes?
(b) If pressure is applied to a point on the surface of the wafer and {111} planecleavage occurs through the pressure point, into how many pieces at maximumwill the wafer break? (A million pieces is not the correct answer.)
(c) Assuming cleavage occurs along a {111} plane, how will the broken edge of thewafer be oriented relative to the primary wafer flat?
