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Microelectronics Fabrication Homework-

1- What is the difference between wet and dry oxidation? Which one is faster? Which one has a better quality?

2- What is FOX? Why FOX region goes under the wafer's surface?

3- What is channel stop? Please explain why it is used.

4- What is the difference between self-aligned and in self-aligned fabrication techniques?

5- What is LDD? Explain.

6- What is a hot carrier? Explain.

7- Why spacer is formed near the gate?

8- What is CND? What is LP-CVD? Explain.

9- What is the difference between wet and dry etching?

10- What is sputtering? Explain.

11- What is Salicide? Explain.

12- What is sintering? Explain.

13- What is RIE and how does it work?

14- What is the energy in Key that is expressed in ion implantation?

15- What is the typical thickness of gate wide?

16- What is the typical thickness of FOX?

17- Why threshold voltage adjustment is done? How does it work?

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