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Environmental concerns have recently motivated the search for replacements for chlorofluorocarbon refrigerants. An experiment has been devised to determine the applicability of one such replacement. A silicon chip is bonded to the bottom of a thin copper plate as shown in the sketch below. The chip is 0.2 cm thick and has a thermal conductivity of 125 W/m K. The copper plate is 0.1 cm thick, and there is no contact resistance between the chip and the copper plate. This assembly is to be cooled by boiling a saturated liquid refrigerant on the copper surface. The electronic circuit on the bottom of the chip generates heat uniformly at a flux. Assume that the sides and the bottom of the chip are insulated.

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Computer Engineering, Engineering

Category:- Computer Engineering
Reference No.:- M92036407

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